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  - patented trench schottky technology - excellent high temperature stability - low forward voltage - lower power loss/ high efficiency - high forward surge capability - ideal for automated placement - halogen-free according to iec 61249-2-21 definition molding compound meets ul 94 v-0 flammability rating packing code with suffix "g" means green compound (halogen-free) terminal: matte tin plated leads, solderable per jesd22-b102 meet jesd 201 class 2 whisker test symbol unit v rrm v i f(av) a i f = 10a i f = 20a i f = 10a i f = 20a t j = 25c a t j = 125c ma r jl c/w t j c t stg c document number: ds_d1410086 version: d15 instantaneous forward voltage (note 1) 0.52 0.42 - v f t j = 125c case: to-277a (smpc) polarity: as marked weight: 0.095g (approximately) 0.43 - marking code 20u60 maximum average forward rectified current 20 peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load storage temperature range - 55 to +150 typical thermal resistance 10 - 100 - 55 to +150 instantaneous reverse current at rated reverse voltage i r a - - min typ max v - compliant to rohs directive 2011/65/eu and in accordance to weee 2002/96/ec trench schottky barrier rectifier are designed for high frequency miniature switched mode power supplies such as adapters, lighting and on-board dc/dc converters. i fsm 280 - 500 0.33 - t j = 25c trench schottky rectifier 60 maximum repetitive peak reverse voltage to-277a (smpc) typical applications TSP20U60S taiwan semiconductor features mechanical data - moisture sensitivity level: level 1, per j-std-020 note 1: pulse test with pulse width = 300 s, 1% duty cycle - 0.48 0.58 - maximum ratings and electrical characteristics (t a = 25c unless otherwise noted) parameter TSP20U60S operating junction temperature range -
(t a = 25c unless otherwise noted) document number: ds_d1410086 version: d15 TSP20U60S taiwan semiconductor ratings and characteristics curves 0.001 0.01 0.1 1 10 100 1000 10 20 30 40 50 60 70 80 90 100 t j =25 o c t j =100 o c t j =125 o c t j =150 o c fig. 3 typical reverse characteristics instantaneous reverse current (ma) percent of rated peak reverse voltage (%) 100 1000 10000 0.1 1 10 100 f=1.0mhz v sig =50mv p-p fig. 4 typical junction capacitance capacitance (pf) reverse voltage (v) 0.01 0.1 1 10 100 0 0.1 0.2 0.3 0.4 0.5 0.6 t j =25 o c t j =125 o c t j =150 o c t j =100 o c fig. 2 typical forward characteristics instantaneous forward current (a) forward voltage (v) 0 5 10 15 20 25 0 25 50 75 100 125 150 with heatsink 30mm x 30mm 4 oz. pad pcb fig.1 forward current derating curve average forward current (a) lead temperature ( o c) TSP20U60S c0g green compound ? code packing ? code part ? no.
min max min max a 5.650 5.750 0.222 0.226 b 6.350 6.650 0.250 0.262 c 4.550 4.650 0.179 0.183 d 3.540 3.840 0.139 0.151 e 4.235 4.535 0.167 0.179 f 1.850 2.150 0.073 0.085 g 3.170 3.470 0.125 0.137 h 1.043 1.343 0.041 0.053 i 1.000 1.300 0.039 0.051 j 1.930 2.230 0.076 0.088 k 0.175 0.325 0.007 0.013 l 1.000 1.200 0.039 0.047 symbol a b c d e f p/n = marking code yw = date code f = factory code document number: ds_d1410086 version: d15 6.80 1.04 marking diagram suggested pad layout unit (mm) 4.80 4.72 1.40 1.27 unit (inch) TSP20U60S taiwan semiconductor package outline dimensions dim. unit (mm) unit (inch) to-277a (smpc) 0.189 0.186 0.055 0.050 0.268 0.041
creat by art assumes no responsibility or liability for any errors or inaccuracies. information contained herein is intended to provide a product description only. no license, express or implied,to any intellectual property rights is granted by this document. except as provided in tsc's terms and conditions of sale for such products, tsc assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of tsc products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. the products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify tsc for any damages resulting from such improper use or sale. document number: ds_d1410086 version: d15 TSP20U60S taiwan semiconductor notice specifications of the products displayed herein are subject to change without notice. tsc or anyone on its behalf,


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